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Therman Derating Curves for Logic-Products Packages
Texas Instruments
Description
This application notes covers users’ need to know the thermal performance of IC packages to be used in their end equipment. Knowing the thermal performance of the IC package for a given device allows the system designer to determine the maximum power that the package can handle.
Company Overview
Texas Instruments develops analog, digital signal processing, RF and DLP® semiconductor technologies that help customers deliver consumer and industrial electronics products with greater performance, increased power efficiency, higher precision, more mobility and better quality.
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